A chronic issue related to the PlayStation 5’s cooling system, which was believed to primarily affect older models, has again been highlighted in recent units. A technician specializing in console repairs diagnosed a liquid metal degradation failure in a PS5 Slim with less than a year and a half of use, confirming that the issue is an inherent vulnerability in the entire Sony console production line.
The failure occurs due to drying and oxidation of the liquid metal compound applied to the Unidade of Processamento Acelerado (APU), the heart of the video game. Esse material is crucial for transferring the heat generated by the processor to the heatsink, and its degradation severely compromises the system’s thermal efficiency, resulting in overheating and potential permanent damage to the hardware if not corrected in time.
Experts in the field and reports from independent technical assistance indicate that the position of the console, whether vertical or horizontal, is not the determining factor in the occurrence of the problem. The failure is associated with the quality of the original factory application and the natural wear of the thermal compound over time, making repair an eventuality for many users.
The origin of the cooling system failure
Sony has chosen to use liquid metal as a thermal interface on the PlayStation 5 since its launch in 2020 for a clear reason: its thermal conductivity is dozens of times higher than that of traditional thermal paste. Essa engineering choice allows the console’s APU to operate at high and stable frequencies without overheating, guaranteeing the performance required by next-generation games. The compound, usually an alloy of gallium and indium, fills the microcracks between the chip and the heatsink, ensuring extremely efficient heat transfer and keeping the system at safe operating temperatures even under maximum load.
However, this advanced technology brings with it durability challenges. Liquid metal may shift or dry out over time, especially due to constant heating and cooling cycles during normal console use. Esse process accelerates the oxidation of gallium, which forms small solid clusters and loses its conductivity properties. Quando this happens, the thermal bridge between the APU and the heatsink is broken, causing heat to be retained in the processor and raising internal temperatures to critical levels, even if the ventilation system is working perfectly.
Warning signs and technical diagnosis
The first symptoms that your PS5’s liquid metal is failing are often subtle and can be mistaken for minor problems. The most common sign is an abnormal increase in fan noise, which starts to operate at full speed constantly, even during light tasks, in an attempt to compensate for inefficient heat dissipation.
As degradation progresses, users may notice a gradual loss of performance, especially in more demanding games, with drops in frame rate and crashes. The most critical stage of the problem manifests itself through automatic shutdowns, a console protection mechanism to prevent the APU from suffering permanent damage from overheating.
During disassembly in the laboratory, the diagnosis is unequivocal. Técnicos find the liquid metal compound dry, oxidized and poorly distributed over the surface of the APU, with residues scattered around the containment barrier. Testes of stress on affected units confirms that temperatures can peak 20 degrees Celsius above normal before repair is effected.
Design evolution in hardware revisions
Aware of the risks associated with liquid metal, Sony implemented gradual improvements in the containment design throughout the different revisions of the PlayStation 5. The launch models, the CFI-1000 series, used simpler barriers, made of foam and rubber, to isolate the APU and prevent the compound from leaking into other motherboard components. Embora effective in most cases, this solution proved vulnerable in units that were frequently moved or had a less precise factory application, leading to the first reports of failures. In response, later hardware revisions, such as those seen in the PS5 Sony engineering added deeper grooves and grooves around the APU socket and on the heatsink itself. Essa change creates a type of mechanical “trap” that helps hold the liquid metal in place, significantly improving the stability of the composite, even when the console is held upright for long periods. Despite these engineering improvements, the quality and quantity of initial material application still varies between different assembly lines, which explains why even newer models are not completely immune to the problem. Relatórios of technical assistance from December 2025 indicate that the failure still persists in approximately 15% of the consoles analyzed, with a notably higher incidence in units with more than two years of continuous use.
Recent incidents confirm chronic failure
One specific case that caught the attention of the technical community occurred on December 9, 2025, involving a PS5 Slim that had been in use for less than 18 months. The console, which had always been kept in a vertical position, began to experience sudden shutdowns. When dismantled, the responsible technician found dry and oxidized residues of liquid metal in the APU.
This incident is significant because it reinforces the conclusion that the failure is not caused by the orientation of the console, but rather by the natural degradation of the thermal compound. The problem is, therefore, a matter of time and usage cycles, potentially affecting all units in circulation.
Data compiled by independent workshops shows an increase in demand for this type of repair. In an analysis of 150 overheating-related repairs, more than 70% of cases were resolved simply by thoroughly cleaning the APU and reapplying a new, high-quality liquid metal compound.
In 2025, Sony started using liquid metal formulas with higher viscosity in its production line, seeking to mitigate the risk of material migration. However, the vast number of older units in circulation, such as the CFI-1000 series, still represents around 40% of cases that reach technical assistance.
Recommendations for console owners
For owners of a PlayStation 5, it is essential to be aware of signs of overheating. Caso the console begins to exhibit excessive fan noise or unexpected shutdowns, the recommendation is to stop use immediately to avoid more serious and irreversible damage to the motherboard or APU.
Para consoles that are still within the warranty period, generally one to two years depending on the region, Sony authorized technical assistance must be contacted to carry out the repair free of charge. For units outside of warranty coverage, the liquid metal reapplication service at specialized assistance centers costs between 200 and 400 dollars, with the procedure taking two to four hours to complete.
The importance of preventative maintenance
Thermal engineering studies suggest that preventative maintenance, carried out every three years, can extend the useful life of the PS5 hardware by up to 50%. Este service includes complete internal cleaning of the cooling system and replacement of the liquid metal, ensuring that the console continues to operate at ideal temperatures.
Implications for production and the market
With more than 77 million PS5 units sold globally by March 2025, the scale of the issue puts pressure on Sony to continually improve its quality control processes. The increase in complaints related to thermal failures in 2025, estimated at 25% more than the previous year, forced the company to prioritize the use of revised components throughout its supply chain.
Adopting the improved containment design, originally developed for the PS5 Pro, into standard Slim model production lines should reduce the incidence of failures in new units. Projeções internals indicate a possible 30% drop in overheating warranty returns in the coming months as new models hit the market.
