A recent patent released on Wednesday, July 15, 2026, suggests that the PlayStation 6 may abandon the liquid metal cooling system, which has caused several problems for PS5 users since its launch in 2020. Instead of the current technology, Sony is considering implementing a more advanced cooling method, based on liquid vaporization.

The liquid metal system, initially touted as a technical advancement for the PS5, quickly became a source of frustration. Many consoles released suffered from unstable cooling and, over time, liquid metal began to leak onto the Accelerated Processing Unit (APU) and other motherboard components. These leaks resulted in increasingly frequent failures, and reports of consoles damaged for this reason persist to this day, without the manufacturer being able to definitively contain the problem.

The complexity of applying liquid metal on the assembly line is one of the main factors behind these disorders. Any minor spillage during manufacturing can cause irreversible damage to components, significantly increasing the risk of production errors and operating costs for the company.

Details about the new PS6 cooling system

The patent reveals that Sony is exploring replacing liquid metal with a vapor chamber system. This technology would use a liquid, such as water, and multiple conical heat pipes to manage internal circulation and maintain a stable temperature. A notable advantage of this system is the ability to function properly even with the console positioned vertically, a feature that generated controversy in the PS5.

From a manufacturing perspective, the vapor chamber represents a significant simplification. It consists of a modular unit that can be coupled directly to the console’s APU through standard procedures, eliminating the need for the highly specific and sensitive processes required by liquid metal. This change has the potential to reduce overall production costs and reduce the risk of assembly line failures, resulting in more consoles working properly and fewer problems for the consumer.

It is important to highlight that registering a patent does not guarantee that the technology described will necessarily be used in the final product. However, it is quite likely that the PS6 will discard liquid metal due to the problems already documented. Still, there is no confirmation that Sony will adopt exactly this patented vaporization system.

What seems clear is the manufacturer’s need to present a more reliable cooling solution for the launch of the PS6. With a speculated price of around US$1,000 or more, repeating the PS5’s launch failures would be a serious setback both for consumers, who expect a high quality product for the amount invested, and for the company’s reputation.