Liquid metal oxidation on PlayStation 5 forces technicians to recommend immediate preventative repairs
Recent laboratory analysis by hardware experts reveals a critical vulnerability in the cooling system of all versions of the Sony console, requiring immediate attention from owners. The focus of the problem is the chemical degradation of liquid metal, a high-efficiency thermal conductor that has replaced traditional thermal paste, but which has demonstrated long-term instability. Técnicos from different parts of the world report that the material is subject to oxidation and displacement processes, which severely compromises the device’s ability to dissipate the heat generated by the processor.
The situation affects both units purchased at launch and more modern revisions, including the Slim models recently introduced to the global market. Diferente From what was previously speculated on community forums, the failure is not strictly linked to the vertical or horizontal position of the equipment, but rather to the volatile nature of the compound of gallium, indium and tin. Over time and heating cycles, dry spots form on the accelerated processing unit (APU), creating areas of excessive heat that the ventilation system cannot neutralize.
PS5 MYTH BUSTED! 🤯
A PS5 SLIM (CFI-2016) console, which is less than 1.5 years old and has been standing VERTICALLY since purchase, is in for service and has the same problem!
Visible on the APU core are dried out and oxidized Liquid Metal (LM) remnants! The LM has formed a…pic.twitter.com/COD7L57lMl— modyfikatorcasper (@Modyfikator89)December 9, 2025
Professionals in the field of electronic repairs highlight that preventative maintenance is no longer an option and has become a necessity to guarantee the useful life of the device. Neglecting signs of thermal wear can lead to irreversible damage to integrated circuits, transforming a simple intervention of cleaning and redistributing the conductor into a significant financial loss, with the possible total loss of the motherboard.
More on this story: First generation PS5 may fail due to liquid metal oxidation
Chemical and mechanical challenges of cooling
The implementation of liquid metal was an engineering decision aimed at enabling high operating frequencies without the excessive noise characteristic of past generations. However, the reality of continuous use has demonstrated that the containment barrier and processor seal face difficulties in keeping the material homogeneous. When opening consoles with a history of random shutdowns, technicians often find oxidized spots where the metal should be liquid and shiny, acting as an efficient thermal bridge.
Esse oxidation phenomenon creates a thermal resistance that prevents the transfer of energy from the chip to the console’s massive heatsink. Como direct consequence, the APU temperature sensor registers critical values and orders the fan rotation to increase to maximum levels, trying to compensate for the physical failure with forced airflow. This behavior generates a vicious cycle of stress on the hardware, accelerating the wear of other internal components.
Even with the design changes promoted by the manufacturer in newer versions, such as modified grooves in the heatsink, the chemical composition of the metal remains susceptible to changes. Relatórios technicians indicate that units with less than two years of use already show visible degradation, suggesting that the industry still needs to improve the application technology or the compound formulation to guarantee stability for prolonged periods.
Clear symptoms of thermal system failure
Users can identify the need for technical intervention by observing the console’s behavior when running games that demand high graphics processing power, especially those with Ray Tracing features enabled. The most common sign is excessive and constant noise from the fan, which starts to operate like a turbine even on days with a mild ambient temperature or in air-conditioned environments.
Another frequent symptom is operating system instability, which can manifest itself through sudden crashes, a noticeable drop in the frame rate per second, or the abrupt closing of applications without specific error codes. In more advanced cases, the console itself displays notifications on the screen warning of overheating before automatically turning off as a safety measure to avoid burning the processor.
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The persistence of these signs indicates that the liquid metal no longer covers the entire surface of the processor die, leaving vital areas exposed to extreme heat. Ignorar these alerts and continuing to use the device in these conditions strains the power supply system and can cause board warping or BGA solder failures due to uneven thermal expansion.
Professional procedures and risks of amateur intervention
It is essential to emphasize that replacing or redistributing liquid metal is a highly complex procedure that should not be carried out by laypeople or curious people. The material is electrically conductive and, if it leaks outside the protective area during a home repair attempt, it will cause an immediate short circuit that will render the console permanently unusable. Apenas laboratories equipped with precision tools and appropriate insulation materials must perform this service.
The correct process involves carefully removing the oxidation present on the silicon surface and on the heatsink, using specific chemicals that do not harm the components. Then, a new layer of liquid metal is applied precisely, ensuring total coverage without excess that could run. Essa maintenance restores the equipment to its original thermal efficiency, allowing it to operate silently and at safe temperatures.
To complement technical care, owners must keep the use environment clean and ventilated. Dust buildup on the heatsink fins exacerbates the liquid metal problem by reducing the airflow needed to cool the system. Manter the console away from walls, away from closed furniture and carrying out regular external cleaning of air inlets are recommended practices to extend the interval between mandatory internal maintenance.
Future perspectives for hardware durability
The games industry is closely watching technical developments involving the use of liquid metals in mass consumer electronics. Enquanto the performance is undeniable, the durability and the need for specialized maintenance raise questions about the longevity of these devices as collectibles in the future. Especialistas believe that upcoming hardware revisions or future generations may opt for hybrid solutions or return to high-performance phase change thermal pastes to mitigate these risks.
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Until definitive solutions are implemented on the production line, the gaming community depends on the support of qualified technicians to keep their consoles operational. Creating a monitoring routine and seeking assistance at the first sign of an anomaly are the best defenses against premature equipment loss. Transparency about these technical limitations helps consumers make more informed decisions about the conservation of their electronic goods.
