COB technology enables 200 MP ultrawide camera and 8K video on iPhone from 2028

The iPhone’s ultrawide camera could receive a significant overhaul, according to a prediction from analyst Ming-Chi Kuo, from TF International Securities. Apple plans to change the mounting technology for this sensor starting in 2028, which will pave the way for considerably higher resolutions. Essa strategic change tackles a long-standing problem with ultra-wide lenses, excessive heating, which currently limits image quality and recording potential.

Market expectations already indicate a possible jump to 200 MP and the ability to record video in 8K. Innovation focused on heat dissipation is crucial to allowing future iPhone models to incorporate high-resolution sensors without compromising the device’s performance or durability. The technological transition represents an important advance in the photography and video capabilities of the company’s smartphones.

Migração of Flip-Chip for COB in ultrawide camera

Current iPhones employ Flip-Chip technology in the ultra-angle camera, where the sensor is mounted upside down. Contatos electricals connect directly to the logic board, an arrangement that contributes to the thinness of the device. Contudo, this configuration hinders efficient heat dissipation, resulting in lower performance of the ultra-wide camera compared to the main camera.

Apple’s bet, as pointed out by Kuo, is to migrate to the COB method (Chip On Board). Nesse system, the sensor is mounted facing upwards, and the connection uses wire bonding, that is, wires replacing solders. Esta approach promises more precise optical alignment and superior thermal control, solving the heating limitation of current technology.

Detalhes of technological change and expected benefits

The comparison between the two approaches, Flip-Chip and COB, highlights the potential gains for iPhone cameras. COB technology offers a structure that better manages the heat generated by the sensor.

• Flip-Chip (current)

* Sensor Posição:Virado down
*Conexão:Soldas (bumps)
*Vantagem main:Aparelho slimmer
*Limitação:Calor harms the sensor

• COB (scheduled for 2028)

* Sensor Posição:Virado up
*Conexão:Wire bonding (wires)
*Vantagem main:Dissipação heat and optical alignment
*Limitação:Under evaluation

Excessive heating generated by the Flip-Chip has been a limiting factor for the Apple to maintain 48 MP sensors instead of advancing to 200 MP. With the heat under control by the COB, the camera module would gain room to receive a 200 MP sensor. Essa same gap would pave the way for 8K video capture, a feature not yet available on any iPhone. It is important to note that Kuo cites Sunny Optical as a possible supplier, but does not link the COB to the 200 MP and 8K numbers as a formal promise from Apple, but rather as an interpretation of technological benefits.

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200 MP Sensores in testing and role of Sunny Optical

The Apple was already mentioned by other leaks as testing 200 MP sensors for the main and telephoto cameras of future iPhones. The expectation regarding the ultra-wide camera adds a new layer to these high-resolution plans. The ability to incorporate more robust sensors into multiple lenses elevates the device’s photographic capabilities.

Kuo’s report highlights Sunny Optical as a prominent name in the supply chain. The manufacturer is well positioned to become a supplier of these cameras when COB technology is implemented. The company has been expanding its participation in Apple optical components.

Expansão from Sunny Optical in the Apple supply chain

Sunny Optical is expected to capture between 40% and 50% of the supply of the variable aperture lens for the iPhone 18 Pro and Pro Max, scheduled for 2026. Este component has an average price about 50% higher than that of the standard lens. The manufacturer demonstrates increasing ability to meet Apple’s advanced component requirements.

Além In addition, Maçã’s company would have secured orders for optical components for two OpenAI devices, a smartphone and a pocket device. Sunny Optical would also be entering the silicon photonics segment for artificial intelligence servers, further diversifying its operations in the technology market.