Just a few years ago, the idea that Qualcomm would replicate functionality from Samsung’s Exynos processor would have seemed unlikely, especially considering Exynos chips’ previous reputation as a “complete disaster” for the industry.

The perception about Samsung’s Exynos, however, began to change significantly with the launch of the Exynos 2600. To prevent the Galaxy S26 and Galaxy S26+ models from overheating, Samsung integrated a copper heatsink, known as Heat Path Block (HPB), which efficiently removes and distributes heat throughout the device, protecting components from thermal damage.

This copper heatsink was positioned directly over the Exynos 2600, requiring the DRAM memory to be relocated to the side of the processor. This configuration ensured direct contact between the processor and the HPB, facilitating thermal conduction and resulting in a 30% reduction in chip temperature compared to the previous generation.

The Exynos 2600 is present in Galaxy S26 and Galaxy S26+ devices in several markets, including Europe, South Korea, India, most of Asia, Africa, the Middle East and South America. However, in the United States, Canada, mainland China and Japan, these models, as well as the Galaxy S26 Ultra in all regions, are equipped with the Qualcomm Snapdragon 8 Elite Gen 5 for Galaxy.

More on this story: Qualcomm confirms Snapdragon Summit 2026 with debut of 2nm Snapdragon 8 Elite Gen 6

Recently, Samsung improved the HPB for use with the Exynos 2700, developing Side-by-Side (SbS) technology. In this new approach, the processor and DRAM will be placed side by side, with the second generation copper heatsink covering both. This will ensure that the heat generated by both the Exynos 2700 and the DRAM is directed to the HPB, preventing heat build-up in the CPU.

The upcoming Exynos 2700 will be produced using Samsung Foundry’s improved SF2P manufacturing process. Compared to the previous 2nm SF2 method, SF2P promises a 12% increase in overall performance and a 25% reduction in power consumption.

Recent information revealed that both Qualcomm and Apple are exploring the application of HPB technology in their own processors. Qualcomm’s tests with its version of the heatsink indicate that the Snapdragon 8 Elite Gen 6 Pro, a chip expected for the Galaxy S27 Ultra, will incorporate HPB similar to that of the Exynos 2600, but with a lower efficiency than Samsung’s implementation, according to informant Reptalica.

Although the tipster Reptalica did not detail the reasons for the lower efficiency of Qualcomm’s HPB, he clarified that the rumors about the production of six different versions of the Snapdragon 8 Elite Gen 6 Pro are incorrect. The expectation is that only two variants of the chipset will be launched.

Details of future Snapdragon 8 Elite Gen 6 chip variants

The Snapdragon 8 Elite Gen 6 Pro (SM8975) will be Qualcomm’s first system-on-chip (SoC) to support LPDDR6 RAM while maintaining compatibility with LPDDR5X, and will feature twice the bandwidth. This will result in significant improvements in the speed of embedded artificial intelligence and GPU data processing. Estimated to cost $300 per unit, this high-performance chip will be reserved for more expensive models like next year’s Galaxy S27 Ultra.

The Snapdragon 8 Elite Gen 6 (SM8950) will have a more affordable production cost than the “Pro” version. Qualcomm will achieve these savings by employing LPDDR5X RAM memory in this edition of the processor.

Learn more: Future Pixel 11 abandons 2nm chip while Google prioritizes system optimization

Additionally, Qualcomm is adjusting the cluster configuration for 6th generation chips, going from 2+6 to 2+3+3 cores. The expected new configuration will include:

• Two “Prime” Phoenix cores, operating at clock speeds of up to 5.0 GHz.
• Three intermediate cores dedicated to “Performance”.
• Three intermediate centers focused on “Efficiency”.

With the inclusion of a 16 MB L2 cache, Qualcomm predicts a significant reduction in system latency.

Due to the complexity and high production cost of 2nm chips, Qualcomm will develop a specific seven-core variant, in which one performance core will be disabled and CPU/GPU clock speeds will be reduced. This version will be sold at a substantial wholesale discount to partners producing upper-middle range smartphones.