Huawei invests in 3D stacking to increase the power of Kirin 2026
Huawei revealed, this Tuesday, July 8, 2026, important details about the design concept of its future Kirin 2026 chipset. The Chinese giant’s new platform confirmed the adoption of the “hybrid bonding” technique, which will allow the implementation of 3D stacking in its internal components, a strategic innovation. The expectation is that this new feature will make its debut in the Mate 90 smartphone line, scheduled for launch in the second half of this year.
Known in Portuguese as “hybrid bonding”, this method represents an advanced process in semiconductor packaging. Its main function is to enable the addition of a three-dimensional stacking layer to the System on a Chip (SoC), ensuring more efficient use of space and superior integration of elements.
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The procedure involves the use of direct copper-to-copper connections, combined with dielectric bonding, which significantly increases the interconnection density of the components. Furthermore, crucial elements like the Central Processing Unit (CPU), Graphics Processing Unit (GPU), Neural Processing Unit (NPU), and Dynamic Random Access memory (DRAM) are organized vertically. This vertical arrangement, mediated by dense points of vertical interconnection, causes data to travel minimal distances, measured in micrometers, rather than the traditional millimeters.
By eliminating the need for electrical signals to travel through long wires, the chip can operate with lower energy consumption for data transmission. This optimization results in a considerable increase in bandwidth and a reduction in signal delay. This technological ingenuity allows Huawei to develop high-performance and efficient chips, even facing restrictions and without unrestricted access to the most advanced lithography equipment available on the international market.
It is important to highlight that the company still operates under significant restrictions resulting from international sanctions. However, Huawei’s plans for its future chips continue, covering ambitious projects such as 1.4 nanometers and recently released details about the Kirin 8030, demonstrating its resilience and focus on innovation.
